Optimized airflow and superior thermal performance are critical in high-powered systems with compact form factors, and ROG Z11 delivers this with a patented interior layout that tilts the motherboard tray at an 11° angle, providing an additional 40 mm of space at the back of the motherboard. This additional space enhances heat dissipation around the CPU and graphics card, as well as the M.2 SSD that can be installed on the back of the motherboard. The layout also enables compatibility with a 3-slot graphics card without a riser cable and creates a striking visual display of components.

ROG Z11 is built for optimized cooling performance. The entire design is conducive to efficient heat discharge from the case via the chimney effect and negative air pressure, which is generated by the fans expelling hot air at a faster rate than intake. With the choice of up to five 120 mm fans, or three 140 mm plus two 120 mm fans, users can maximize airflow and have the flexibility to customize.